Features

• High Throughput
  • High speed bonding: up to 22,000* UPH
  • Implementing patented design
    • Double decoupled linear motor bond head system
  • Enhanced dual stamping / dot dispensing speed by latest actuating control system
  • Further improving bonding speed with rotary collet bond arm system
    • Providing automatic theta collection during pick & place process
• Fast Conversion Time by
  • New stamping arm design
  • Magnetic anvil block design
• Latest ASMPT Developed PR System
  • Static bond optic system without motor used
  • Simpler operation and easy maintenance
  • Reducing time for a bonding cycle
    • Taking pre-bond and post-bond inspection at the same time