Features

• AD838L Series exclusive material handling capability, dragging-free indexing
• Advanced bond head design, patented technology, achieving high UPH
• Extra-large substrate material handling, up to 300 mm x 100 mm
• High precision bonding option
  • Achieving ±15 μm @ 3σ XY placement accuracy*
  • Patented technology, without any UPH trade-off for high precision bonding
• Achieving factory automation
  • Automatic material handling system
  • Automatic wafer loader (option)