Features

• Achieving ± 3 µm* @ 3σ XY placement with patented look-through pattern recognition
• Flip chip handling capability
• Diverse material handling
  • Standard: Wafer on expander or clamp ring
  • Optional: Waffle pack, Gel-Pak, tray, tape feeder or by request
• Enhancing traceability by barcode, 2D code or OCR on substrate / wafer / die (Option)